{"product_id":"ic-packaging-von-rojalin-hemant-warad","title":"IC Packaging","description":"\u003cp\u003eIntegrated circuit (IC) was first developed in 1950s  in response to demands in miniaturized electronics.  Today IC''s are at the core of a modern digital  system. If chips could be used in unmodified form  packaging would be unnecessary, thus cheaper. A tiny  speck of dust can hinder its functionality.  Packaging is the final stage in semiconductor device  fabrication, which places bare dies inside a  protective package, providing pins for external  connections. Ultra Thin Small Outline Package is  primarily intended to provide increased capacity and  functionality in the design of processors, memories  amongst others. The most challenging feature of  small outline transistor is their small size,  meaning effective package diameter is on the same  order of magnitude as the board thickness. In this  work we have analyzed reliability of ultra small  packages under different test conditions and  investigated for common failures under various  failure analysis methods. Of the different  categories of small thin (ST) packages, ST553, ST563  and ST953 were studied. The tests developed would be  useful for construction analysis on ST package for  optimum performance\u003c\/p\u003e\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9783838385679\"\u003e\u003ch3\u003ePackage Construction Analysis in Ultra Small IC Packaging\u003c\/h3\u003e\u003c\/div\u003e","brand":"Autorenwelt Shop","offers":[{"title":"Softcover - 9783838385679","offer_id":39498910990429,"sku":"9783838385679","price":49.0,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/1eb30e5e-ad67-4ee9-a56b-7892674c834b.jpg?v=1773383110","url":"https:\/\/shop.autorenwelt.de\/en\/products\/ic-packaging-von-rojalin-hemant-warad","provider":"Autorenwelt Shop","version":"1.0","type":"link"}