{"product_id":"flip-chip-hybrid-bonding-fan-in-and-fan-out-technology-von-john-h-lau","title":"Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology","description":"\n                                \n                \u003cp\u003eThis book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.\u003c\/p\u003e\n                                \n                \u003cp\u003eThe book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.\u003c\/p\u003e\n                            \n            \u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9789819721399\"\u003e\u003ch3\u003e\u003c\/h3\u003e\u003c\/div\u003e","brand":"Autorenwelt Shop","offers":[{"title":"Hardcover - 9789819721399","offer_id":48781684834629,"sku":"9789819721399","price":181.89,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/b135b2bb-a58e-448d-b270-b370e95189d0.jpg?v=1772429888","url":"https:\/\/shop.autorenwelt.de\/en\/products\/flip-chip-hybrid-bonding-fan-in-and-fan-out-technology-von-john-h-lau","provider":"Autorenwelt Shop","version":"1.0","type":"link"}