{"product_id":"die-attach-materials-for-high-temperature-applications-in-microelectronics-packaging-materials-processes-equipment-and-reliability-von-kim-s-siow-kim-s-siow-hrsg","title":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","description":"\n                \u003cp\u003e\u003c\/p\u003e\n                \u003cp\u003e\u003c\/p\u003e\n                \u003cp\u003e\u003c\/p\u003e\n                \u003cp\u003eThis book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.\u003c\/p\u003e\n                \u003cp\u003e\u003c\/p\u003e\n                \u003cul\u003e\n                    \u003cli\u003eAddresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials;\u003cbr\u003e\n                    \u003c\/li\u003e\n                    \u003cli\u003eEmphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;\u003cbr\u003e\n                    \u003c\/li\u003e\n                    \u003cli\u003eSimultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.\u003cbr\u003e\n                    \u003c\/li\u003e\n                \u003c\/ul\u003e\n                \u003cp\u003e\u003c\/p\u003e\n                \u003cp\u003e\u003c\/p\u003e\n                \u003cp\u003e\n                    \u003cbr\u003e\n                \u003c\/p\u003e\n            \u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9783319992556\"\u003e\u003ch3\u003eMaterials, Processes, Equipment, and Reliability\u003c\/h3\u003e\u003c\/div\u003e","brand":"Libri","offers":[{"title":"Hardcover - 9783319992556","offer_id":39392755843165,"sku":"9783319992556","price":192.59,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/5f6cdd06-dd0e-455d-985d-0358d063391b.jpg?v=1769319153","url":"https:\/\/shop.autorenwelt.de\/en\/products\/die-attach-materials-for-high-temperature-applications-in-microelectronics-packaging-materials-processes-equipment-and-reliability-von-kim-s-siow-kim-s-siow-hrsg","provider":"Autorenwelt Shop","version":"1.0","type":"link"}