{"product_id":"development-of-sub-mm-wave-flip-chip-interconnect-von-sirinpa-monayakul","title":"Development of Sub-mm Wave Flip-Chip Interconnect","description":"\u003cp\u003eWith the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz.\u003c\/p\u003e\u003cp\u003eFlip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.\u003c\/p\u003e\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9783736994102\"\u003e\u003ch3\u003e\u003c\/h3\u003e\u003c\/div\u003e","brand":"Autorenwelt Shop","offers":[{"title":"Softcover - 9783736994102","offer_id":47040237797701,"sku":"9783736994102","price":44.0,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/506e9766-18c8-4de8-9977-4598862bf00f.jpg?v=1756876915","url":"https:\/\/shop.autorenwelt.de\/en\/products\/development-of-sub-mm-wave-flip-chip-interconnect-von-sirinpa-monayakul","provider":"Autorenwelt Shop","version":"1.0","type":"link"}